焊絲與焊膏
先藝電子可提供多種規(guī)格的焊絲與焊膏以滿足不同電子組裝應(yīng)用的需求，焊絲最小直徑可達(dá)φ0.1mm，焊膏粉末粒徑最細(xì)可提供T7型號(hào)。
焊膏規(guī)格
成分 | 熔化溫度℃ | 焊膏粉末規(guī)格 | 包裝 | 交期 | ||
針筒裝 | 罐裝 | |||||
無鉛 | Bi58Sn42 | 138 | T4~T6 | 10cc 30cc 50cc | 500g | 7-14 個(gè)工作日 |
Sn96.5Ag3.0Cu0.5 | 217~218 | |||||
Sn96.5Ag3.5 | 221 | |||||
Sn99Ag0.3Cu0.7 | 217~227 | |||||
Sn99Ag0.5Cu0.5 | 227 | |||||
Sn99.3Cu0.7 | 227 | |||||
Sn90Sb10 | 240~250 | |||||
Sn95Sb5 | 235~240 | |||||
含鉛 | Sn62Pb36Ag2 | 179 | ||||
Sn63Pb37 | 183 | |||||
Pb90Sn10 | 275~302 | |||||
Pb92.5Sn5Ag2.5 | 287~296 | |||||
焊絲規(guī)格
成分 | 熔化溫度℃ | 焊絲直徑 | 包裝 | 交期 | |
無鉛 | In52Sn48 | 118 | ≥φ0.6mm | 200g 500g 1000g | 7-14 個(gè)工作日 |
Bi58Sn42 | 138 | ≥φ0.5mm | |||
Bi575n42Ag1 | 138~140 | ≥φ0.5mm | |||
In97Ag3 | 143 | ≥φ1.0mm | |||
In100 | 157 | ≥φ1.0mm | |||
Sn64Bi35Ag1 | 138~187 | ≥φ0.3mm | |||
Sn96.5Ag3.0Cu0.5 | 217~218 | ≥φ0.10mm | |||
Sn99.3Cu0.7 | 227 | ≥φ0.3mm | |||
Sn90Sb10 | 240~250 | ≥φ0.5mm | |||
Sn95Sb5 | 235~240 | ≥φ0.5mm | |||
含鉛 | Sn62Pb36Ag2 | 179 | ≥φ0.38mm | ||
Sn63Pb37 | 183 | ≥φ0.38mm | |||
Pb90Sn10 | 275~302 | ≥φ0.5mm | |||
Pb92.5Sn5Ag2.5 | 287~296 | ≥φ0.8mm | |||
*"In含量≥50%的焊料無法提供藥芯焊絲
